Biocompatible epoxies for manufacturing medical devices
|When used as adhesive encapsulants, two-part epoxies in medical devices improve the ruggedness of wire-bonded, chip-on-board microelectronic assemblies. Biocompatible products from Master Bond include EP42HT-2Med and the enhanced EP42HT-4AOMed Black product.|
Microelectronics devices composed of integrated circuits are complex and pose many engineering challenges. A careful design must be employed to allow heat to be dissipated from the device and mitigate thermally induced stresses.
Adhesive encapsulants have been developed to seal and protect the sensitive electrical components and connections from contaminants and assist with thermal management. Encapsulants provide mechanical support, distribute stresses, and protect sensitive connections from mechanical shock.
Typically, encapsulants with ceramic fillers provide enhanced thermal conductivity and improve the heat transfer and heat dissipation properties of the design, while a reduction in the thermal coefficient of expansion of the encapsulant mitigates stresses from thermal mismatch.
Depending on application demands, encapsulant adhesives can be formulated for a wide range of viscosities and provide various thermal, mechanical and environmental resistance properties. Products may be engineered for application specific approvals like ISO 10993-5 and USP Class VI for use in medical devices, NASA low outgassing requirements, and cryogenic serviceability.